Highlights of productronica 2025 – The 50th Anniversary Edition of the World’s Leading Electronics Fair

The countdown is on for the anniversary edition of productronica. This autumn, the world’s leading trade fair for electronics development and manufacturing celebrates its 50th anniversary. From 18 to 21 November, Munich will once again become the meeting point for the international electronics industry. The key themes of productronica 2025 include Advanced Packaging, Power Electronics and Trusted Microelectronics. As in previous years, SEMICON Europa will take place concurrently on the grounds of Messe München. The conceptual partner of productronica is the VDMA Productronic industry association.

For its 50th anniversary, productronica can look forward to well-filled exhibition halls. More than 1,600 companies from over 50 countries will present solutions and products shaping the future of electronics manufacturing. In addition to productronica, which occupies seven halls and a total area of 80,000 m², the parallel SEMICON Europa will showcase innovations and trends from the semiconductor sector across 25,000 m² and three halls.

Messe München Managing Director Dr. Reinhard Pfeiffer expresses his satisfaction shortly before the start of the fair: “We are delighted to record a significant increase on the exhibitor side. Compared to the previous event, exhibitor numbers have grown by 16 percent. This once again underscores the role of productronica and SEMICON Europa in positioning Munich as a leading international hub for electronics manufacturing.”

Special Exhibitions Focus on productronica Lead Themes

In addition to the exhibition area with its six focus segments—PCB & EMS, SMT, Cables, Coils & Hybrids, Semiconductor, Future Production and Overall Production Support—the supporting program of productronica also places a strong emphasis on the three lead themes.

The VDMA Productronic Special Exhibition (Hall B2, Stand 461) will feature exhibits and live demonstrations from eight companies, covering chip development, advanced packaging, power electronics for electric mobility and electric aviation. One highlight of the special area will be an aircraft equipped with an electric drive. The University of Applied Sciences Kaiserslautern will present the “skills4chips” project and the newly founded national “Microtec Academy.” The Excellence Cluster PhoenixD for optical technologies will also contribute. Schweizer Electronic will showcase the circuit board of the future.

Another key element of the VDMA special exhibition will be autonomous driving. The Volkswagen ID Buzz test vehicle, part of the Fraunhofer IDMT joint project “KI4BoardNet,” provides insights into multisensory solutions that enhance user experience and safety in vehicles. These include voice-based interactions between users and the vehicle as well as AI-driven acoustic monitoring systems.

At the “Future Packaging” live production line hosted by Fraunhofer IZM (Hall B2, Stand 261), 21 companies will demonstrate every step of PCB manufacturing on a 360 m² area—illustrating the capabilities of modern technologies and processes, such as board marking or laser depaneling vs. routing. The real-lab setup records live consumption data from the production line, allowing visitors to track the CO₂ footprint of the assembly process in real time.

Additional live demonstrations include the event stage “Cleanroom” and the IPC Hand Soldering Competition. The Cleanroom Stage (Hall B2, Stand 358), organised by mycleanroom, shows professionals what the cleanroom of the future looks like and how high-tech, ergonomics and flexibility will interact in controlled environments for microelectronics production.

In cooperation with the Global Electronic Association, productronica will again determine the world champion in hand soldering. Qualification rounds will take place on the first two days of the fair in Hall A1, Stand 321. The world championship finals will be held on Friday, 21 November. Participants have 60 minutes to assemble a complex PCB according to IPC-A-610 Class 3 specifications.

Supporting Forums Discuss the Future of Electronics Manufacturing

More than 70 presentations, roundtables and panel discussions on current and future industry topics will take place across productronica’s three stages: the productronica Forum, the Innovation Forum and the PCB & EMS Marketplace. Among the many sessions, two stand out.

On Wednesday, 19 November at 13:15, a panel discussion in the Innovation Forum (Hall B2, Stand 441) will explore the question: “Microelectronics in safety-critical applications – which measures are required to ensure security along the supply chain?” Using practical examples, the panel will examine what secure electronics entail and the importance of secure components for Europe’s mechanical engineering sector.

One day later, on Thursday, 20 November at 10:15, another expert panel will discuss “What opportunities does innovative power electronics offer the mechanical engineering sector?” The session will focus on emerging requirements arising from new power-electronics components as well as successful technology transfer from research into industrial practice.

79 Entries for the productronica Innovation Award 2025

The productronica Innovation Award will be presented for the sixth time at the world’s leading trade fair for electronics development and manufacturing. In the six categories—PCB & EMS, SMT, Inspection & Quality, Semiconductors, Cables, Coils & Hybrids and Future Markets—the award recognises innovative product developments and manufacturing processes. The winners from a total of 79 submissions will be announced during the exhibitor evening on the opening day of the fair.

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